LM336-2.5 Electronic IC Chips 2.5V INTEGRATED REFERENCE CIRCUITS

LM236-2.5, LM336-2.5, LM336B-2.5

2.5V INTEGRATED REFERENCE CIRCUITS



• Low Temperature Coefficient
  
• Wide Operating Current . . . 400 µA to 10 mA
  
• 0.27-Ω Dynamic Impedance
  
• ±1% Tolerance Available
  
• Specified Temperature Stability
  
• Easily Trimmed for Minimum Temperature Drift
  
• Fast Turnon
  
           

description

The LM236-2.5, LM336-2.5, and LM336B-2.5 integrated circuits are precision 2.5-V shunt regulator diodes. These reference circuits operate as low-temperature-coefficient 2.5-V Zener diodes with a 0.2-Ω dynamic impedance. A third terminal provided on the circuit allows the reference voltage and temperature coefficient to be trimmed easily. 

The series is useful as precision 2.5-V low-voltage references (V_Z) for digital voltmeters, power supplies, or operational-amplifier circuitry. The 2.5-V voltage reference makes it convenient to obtain a stable reference from 5-V logic supplies. Devices in this series operate as shunt regulators, and can be used as either positive or negative voltage references.

The LM236-2.5 is characterized for operation from −25°C to 85°C. The LM336-2.5 and LM336B-2.5 are characterized for operation from 0°C to 70°C.

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†

Reverse current, I_R . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA

Forward current, I_F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA

Package thermal impedance, θ_JA (see Notes 1 and 2): D package  . . . . . . . . . . . . . . . . . . . 97°C/W

                                                                                      LP package  . . . . . . . . . . . . . . . . . . 140°C/W

Operating virtual junction temperature, TJ  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C

Storage temperature range, Tstg  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can impact reliability.

2. The package thermal impedance is calculated in accordance with JESD 51-7.

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